Foundry & Packaging Services (FAB): OICS industry class

01

Where it sits

Sector, group and industry above this class, as placed in the current release. The sector and the industry link to their companies.

Sector: TC Technology in the standard Software, IT services, hardware and semiconductors.
Group: TC.SC Semiconductors Chips and the tools to make them.
Industry: TC.SC.SEM Semiconductors in the standard Chips and the tools to make them.

02

Companies in this class

Companies whose primary class this is. The sector and industry pages and the screener count them the same way.

All companies108 Listed with filings83

Largest first Name Country

Counted by primary class: every company classified here, including delisted companies and companies without filings.

Company	Ticker	Country	Market cap	Filings
盛合晶微	688820	China	—	67
KESM INDUSTRIES BERHAD	—	Malaysia	—	39
粤芯半导体	301660	China	—	37
Raytek Semiconductor, Inc.	7873	Taiwan	—	22
ALPHATEC ELECTRONICS PUBLIC COMPANY LIMITED Delisted	ATEC	Thailand	—	6
TSMC ARIZONA CORPORATION	48BB	United States of America	—	1
Stanford Microsystems, Inc Delisted	MICRO	Philippines (the)	—	0
Stats Chippac Inc Delisted	CHPC1	United States of America	—	0

Companies in Semiconductors → Open in the screener →

03

Boundaries

Other names for this activity, and where neighboring activities go instead.

Also known as

foundryOSATadvanced packaging

Not here

a chipmaker selling mostly its own designs → CHP Chip Design & Integrated Chipmakers

Sent here from

CHP Chip Design & Integrated Chipmakers

04

Other classes in Semiconductors

Chip Design & Integrated Chipmakers CHP TC.SC.SEM.CHP

Designs and sells processors, accelerators, logic, analog, power and other non-memory chips, fabless or with its own fabs.

Also fabless, GPU, AI accelerator, IDM

Not here makes chips designed by others → FAB Foundry & Packaging Services
Not here memory chips → MEM Memory Chips

Memory Chips MEM TC.SC.SEM.MEM

Designs and makes DRAM, high-bandwidth memory, NAND flash and other memory chips.

Also DRAM, HBM, NAND

Not here storage drives and systems → PCS Computers

Chipmaking Equipment & Materials SME TC.SC.SEM.SME

Makes wafer-fab equipment, chip test and assembly equipment, wafers, photomasks or semiconductor materials.

Also wafer fab equipment, lithography, semiconductor test equipment, ATE

05

Permanent link

https://financialfilings.com/oics/FAB/

This page is keyed by the class ID FAB. IDs are assigned in v0.3 and freeze at v1.0; from then on an ID is never renamed or reused, and if the class moves in the tree, its ID and this URL stay the same.

See it in the full standard Download the standard