Manufactures chips designed by others, or assembles, packages and tests them, including advanced packaging.
Also foundry, OSAT, advanced packaging
- Not here a chipmaker selling mostly its own designs → CHP Chip Design & Integrated Chipmakers
ID CHP TC.SC.SEM.CHP
Designs and sells processors, accelerators, logic, analog, power and other non-memory chips, fabless or with its own fabs.
Sector, group and industry above this class, as placed in the current release. The sector and the industry link to their companies.
Companies whose primary class this is. The sector and industry pages and the screener count them the same way.
| Company | Ticker | Country | Market cap | Filings |
|---|---|---|---|---|
| Cambricon Technologies Corporation Limited | 688256 | China | — | 915 |
| N CITRON, INC. | 101400 | South Korea | — | 915 |
| Yield Microelectronics Corp. | 6423 | Taiwan | — | 915 |
| Leaguer (Shenzhen) Microelectronics Corp. | 688589 | China | — | 911 |
| 敦南 Delisted | 5305 | Taiwan | — | 900 |
| Genesis Photonics Inc Delisted | 3383 | Taiwan | — | 899 |
| Amlogic (Shanghai) Co.,Ltd. | 688099 | China | — | 887 |
| National Semiconductor Corp Delisted | NSM_old | United States of America | — | 887 |
| Atheros Communications Inc Delisted | ATHR_old | United States of America | — | 885 |
| TLi Inc Delisted | 062860 | South Korea | — | 880 |
| Solomon Systech (International) Limited | 2878 | Cayman Islands | — | 873 |
| WFE TECHNOLOGY CORP. | 6474 | Taiwan | — | 865 |
| China Electronics Huada Technology Company Limited | 85 | Hong Kong | — | 862 |
| Sensortek Technology Corp. | 6732 | Taiwan | — | 860 |
| SUZHOU NOVOSENSE MICROELECTRONICS CO., LTD. | 688052 | China | — | 851 |
| AlgolTek, Inc. | 6684 | Taiwan | — | 835 |
| Ikanos Communications Inc Delisted | IKAN | United States of America | — | 833 |
| RFsemiTechnologies,Inc. Delisted | 096610 | South Korea | — | 833 |
| GigPeak, Inc. Delisted | — | United States of America | — | 825 |
| TelechipsInc. | 054450 | South Korea | — | 818 |
| PLX TECHNOLOGY INC Delisted | — | United States of America | — | 814 |
| Changzhou Galaxy Century Microelectronics Co.,Ltd. | 688689 | China | — | 802 |
| ACTEL CORP Delisted | — | United States of America | — | 801 |
| IXYS Corp Delisted | IXYS | United States of America | — | 793 |
| Cystech Electronics Corp. | 6651 | Taiwan | — | 789 |
| FORTIOR TECHNOLOGY(SHENZHEN)CO., LTD. | 688279 | China | — | 772 |
| Macmic Science&Technology Co., Ltd. | 688711 | China | — | 766 |
| Beken Corporation | 603068 | China | — | 761 |
| Cavium Inc Delisted | CAVM | United States of America | — | 756 |
| Anapass, Inc. | 123860 | South Korea | — | 746 |
| Starpower Semiconductor Ltd. | 603290 | China | — | 744 |
| WUXI NCE POWER CO.,LTD. | 605111 | China | — | 732 |
| NC& Co., Ltd. | 092600 | South Korea | — | 727 |
| MIPS TECHNOLOGIES INC Delisted | — | United States of America | — | 715 |
| Volterra Semiconductor Corp Delisted | VLTR | United States of America | — | 712 |
| TRIDENT MICROSYSTEMS INC Delisted | — | United States of America | — | 709 |
| Bestechnic (Shanghai) Co., Ltd. | 688608 | China | — | 703 |
| ROHM COMPANY LIMITED | 6963 | Japan | — | 701 |
| SHANGHAI AWINIC TECHNOLOGY CO.,LTD. | 688798 | China | — | 690 |
| UNION SEMICONDUCTOR (HEFEI) CO., LTD. | 688403 | China | — | 688 |
| 信億科技股份有限公司 Delisted | 3126 | Taiwan | — | 682 |
| Renesas Electronics Corporation | 6723 | Japan | — | 681 |
| 昂寶電子股份有限公司 Delisted | 4947 | Taiwan | — | 672 |
| EZCHIP SEMICONDUCTOR LTD. Delisted | — | Israel | — | 671 |
| GSN CORP Delisted | — | Hong Kong | — | 669 |
| Entropic Communications Inc Delisted | ENTR1 | United States of America | — | 664 |
| RIR POWER ELECTRONICS LIMITED | 517035 | India | — | 664 |
| C*CORE TECHNOLOGY CO., LTD. | 688262 | China | — | 654 |
| China Resources Microelectronics Limited | 688396 | China | — | 654 |
| Gch Technology Co.,Ltd. | 688625 | China | — | 653 |
Other names for this activity, and where neighboring activities go instead.
fablessGPUAI acceleratorIDM
Manufactures chips designed by others, or assembles, packages and tests them, including advanced packaging.
Also foundry, OSAT, advanced packaging
Designs and makes DRAM, high-bandwidth memory, NAND flash and other memory chips.
Also DRAM, HBM, NAND
Makes wafer-fab equipment, chip test and assembly equipment, wafers, photomasks or semiconductor materials.
Also wafer fab equipment, lithography, semiconductor test equipment, ATE
https://financialfilings.com/oics/CHP/
This page is keyed by the class ID CHP. IDs are assigned in v0.3 and freeze at v1.0; from then on an ID is never renamed or reused, and if the class moves in the tree, its ID and this URL stay the same.
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