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welcome welcome

新日興股份有限公司 SHIN ZU SHING CO., LTD.

Since 1968

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大綱 Introduction

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公司簡介 Company Profile 產業概況 Industrial Overview

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營運策略及成果 Business Strategy and Operation Results 競爭優勢與未來研發方向 Competency Advantage and R&D Action Plan

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公司概況 Snapshots

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創立時間: 1968 年 6 月 28 日 Established: June 28, 1968

總公司地址：新北市樹林區俊英街 174 號

蘇州欣日興地址：江蘇省蘇州市甪直鎮經濟開發區鴻運路 1 號 蘇州智群廠地址：江蘇省蘇州市吴中區甪直鎖重村路 6 號 四川新鴻興廠地址：重慶市壁山縣壁城街道原觀音村一社 3 幢 第 2 、 3 屬

董事長: 呂勝男 Chairman: Sheng-Nan Lu

總經理: 林清正 C.E.O: Frank Lin

昆山呈杰廠地址：江蘇省昆山市張浦鎮南港富利路 118 號 東莞呈越廠地址：廣東省東莞市大朗鎮石夏仙村深龍路 福清泓興地址：福清市融僑經濟技術開發區（耀華工業村） 昆山呈偉廠地址：江蘇省昆山市張浦鎮南港建林路 211 號 新加坡廠地址：新加坡八文里道

資本額: 新台幣：壹拾柒億捌仟柒佰貳拾伍萬 Capital: NTD 1,787,253,460

臺灣員工: 1,819 (Taipe,Taiwan) 大陸員工 : 991 (Suzhou SZS, China) 152 (Suzhou ZQ, China) 253 (Red Star 泓興 , China) 402 ( 新鴻興 ,China)

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• 主要業務： 樞紐產品 ( 筆記型電腦、液晶顯示器、 CDs 資訊 產品等相關連結樞紐 ) 、精密線類、板類彈簧製 品、精密金屬沖壓件

Main Products (including OEM, ODM):

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Factory: 19,417 m2 (Taipei, Taiwan) 33,256 m2 (Suzhou SZS, China) 4,000 m2 (Suzhou ZQ, China) 25,130 m2 (Red Star, China) 3,000 m2 ( 新鴻興 ,China)

Hinges for NB, Tablet PC\LCD monitor\Mobile phone & PDA\DV & Digital still Camera & Consumer products,…and etc; Precession Wire springs, Forming, Stampings, Engineering Plastic parts,…and etc.

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樞軸產業概況 Hinge Industrial Overview

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全球筆記型電腦市場需求 Global Demand for Notebooks (NB)

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全球 LCD 市場需求 Global Demand for LCD(TFT-LCD Monitor)

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全球粉末冶金市場需求 Global Demand for MIM

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全球筆記型電腦市場需求 Global Demand for NB PCs

195,000 40.0 192,356 Thousand Units Growth% 190,000 30.0 185,000 180,000 20.0 175,000 172,602 172,130 10.0 170,000 167,482 166,806 166,310 165,976 165,645 165,000 0.0 -0.3 -0.7 -0.4 0.2 0.5 -1.6 160,000 -2.7 -10.0 155,000 -10.3 150,000 -20.0 2012 2013 2014 2015E 2016F 2017F 2018F 2019F

Source: MIC MAY. 2015

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全球監視器市場需求 Global Demand for LCD Monitor (Only Desktop & AIO)

6.00 4.00 2.00 0.00 -2.00 -4.00 -6.00 -8.00

Source: MIC May 2014

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AIO PC Global Shipments

1

Source

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2014 全球 MIM 市場概況 Global MIM market information 2014 MIM 全球市場規模： 19 億美金，在後續幾年會成長到 28 億美 金。

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The global MIM market was $1.9 billion in 2014 and will be expected to reach at $2.9 billion by 2018.

全球 MIM 市場成長率 (CAGR) ： 11.4%

This market compound annual rate is expected to 11.4% over the next 6 years

美國 MIM 市場主要產品：醫療、牙齒矯正、槍枝零件 Main products in the US market: Medical, Orthodontia, Firearm. 歐洲 MIM 市場主要產品： 汽車零件和消費性產品

Main products in the EU market: Auto component and Consumer product.

亞洲 MIM 市場主要產品： IT 、電子產品和工具零件 Main product in the Asia market: IT, Electronics products and tool components.

其它 MIM 市場：工具及其它產品 Others :tool component and others.

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Source: BBC research

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2014 MIM 全球市場銷售額及百分比

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營運策略及成果 Business Strategy and Operation Results

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營運模式 Operation Model 主要營業比重 Revenue Mix 經營成果 Operation Results

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營運模式 Operation Model

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主要營業比重 2015Q3 Revenue Mix (Thousand NT Dollars)

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樞紐組立製品
Hinges & Assemblies
NBs 3,853,888 Pressings
&
LCDs 1,258,307
CDs 193,379 Springs Stampings
MIM
Other 43,538 1.25% 0.61%
8.65%
Other
Hinges- 0.74%
彈簧製品
other
Springs 0.72%
75,595
Hinges-CD
3.21%
沖件製品
Pressings & Stampings
36,665
粉末冶金
Hinges-
MIM
LCD
521,177 20.88%
Hinges-NB
63.94%
其他 合併總營收
Other 44,370 Total Consolidated Sales
6,026,919
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經營成果 Operation Results

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營收狀況 Consolidated Revenue

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2010~2015 年營收趨勢 Consolidated Revenue Trend

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各季別營收及毛利率 Consolidated Revenue Q by Q

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全球市場佔有率 Market Share

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合併財務比率分析 Consolidated Financial Analysis

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Million NT Dollars

營收狀況 Consolidated Revenue

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2010~2015 年合併營收趨勢 Consolidated Revenue Trend Million NT Dollars

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900
821
800
768
680 751 741 746 749 731 735 728
700 711 652 684 713 652 705 697 701720 708 703 703707
686671 612 653 679653 681 682 653 656
600 599.746625609624607 611638620 610 618 669 645 630 618 621
590 584
534
500 506 515.251704 510
489
461 463
423
400 393
2010 2011
300
2012 2013
200
2014 2015
100
0
1 2 3 4 5 6 7 8 9 10 11 12
Month
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各季別營業收入及毛利率 Consolidated Revenue Quarter by Quarter Million NT Dollars

2,500

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全球市場佔有率 Market Share (Hinges for NB PCs worldwide) Thousand Units Market share

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合併財務比率分析 Consolidated Financial Analysis

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Financial structure 50
財務結構(%) 45
39.29
40
33.43 34.21
35 32.63
30 25.87 22.29
25
24.14
20
2009 2010 2011 2012 2013 2014 2015Q3
Debt-paying ability
償債能力(%) 400 367.01
302.64 326.62
303.19
300 255.41 242.72 234.86 337.86
301.07
200 280.16 279.63
235.92
216.27 214.30
100
0
2009 2010 2011 2012 2013 2014 2015Q 3
Earning capability
獲利能力(%) 30
21.56 20.99
20 19.37
20.52
9.8 11.44 9.05 10.96
10 11.13 4.76 12.07 11.25 14.36
0 4.62
2009 2010 2011 2012 2013 2014 2015Q3
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競爭優勢與未來研發方向 Competency Advantage and R&D Action Plan

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競 爭 優 勢 Competency Advantage

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未來研發方向 R & D Action Plan

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競爭優勢 Competency Advantage

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完整之產品製程組合，滿足客戶需求 Expansion of complete product lines to better serve customers.

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累積多年之設計及製程資料庫，研發設計能力已達世界水準 Database accumulated from designing and engineering experiences enable R&D to achieve a world-class standard. 靈活快速之對應能力，與客戶建立長期良好之合作默契 Prompt solutions remain a key factor in the maintenance of longterm business-to-client relationships.

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競爭優勢(續) Competency Advantage (cont.)

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豐富的管理技術與領先同業之製程技術 Abundant technology and management skills provide an advantage over competition.

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具規模經濟之全系列合理化機器設備 Mass production facilities operate at cost-efficient capacity.

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堅強之經營管理團隊 A team of loyal and brilliant talents.

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經營績效良好，財務健全穩定 Structured operation holds to be a key factor to the continuation . of a solid financial standing

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未來研發方向 R & D Action Plan

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各國專利領證件數 Worldwide Patents

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未來研發方向 R & D Action Plan

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各國專利領證件數(Unit：Cases) Worldwide Patents (2015/09/30)

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U.K.: 2
Germany: 2
France : 1
Philippine: 1
U.S.A.: 12 0
Taiwan: 315
Japan: 45
China: 296
Korea:21
Hong Kong: 2
Singapore: 4
專利領證合計 1,138 張 申請認證中專利合計 15件
Current: 1,138 Processing: 15
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各國專利領證件數 Worldwide Patents (2015/09/30)

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15
19
36
60
85
117
800
200
173
196
600
1138
1114
1083
1018
967
160
825
400
97
668
616
521
200
377
297
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1,200

1,000

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015Q3

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未來研發方向 R & D Action Plan

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掌握 CDs 產品市場之脈動，設計具利基之高附加價值產品

Understand market trends in consumer electronics and design products with added-values.

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研發輕薄短小、具高鋼性、低成本及多功能之樞紐結構

Develop small, steel-based ,lower cost and multi-purpose hinges.

研發高耐受性之樞紐標準件，以利客戶成本合理化

Develop high-endurance standard parts to better serve customers by minimizing their production costs.

發展材料科技領域(如鋁、鎂、鈦等環保材質)

Launch new material technologies. (i.e. Al, Mg, Ti and others )

導入高強度、高複雜度之零件生產技術(如金屬射出工法)

Introduce technology for high tension and complex parts, such as MIM.

積極進行異業策略聯盟

Proceed with strategic cross-industry alliances, such as precision-plastic molding.

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~The End~ Thank You 簡 報 結 束 敬 請 指 教

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