AI assistant
Orient Semiconductor Electronics, Ltd. — Interim / Quarterly Report 2025
Nov 14, 2025
52010_rns_2025-11-14_4f121f3e-ae46-4d03-a4c0-dbfd58ac13ac.pdf
Interim / Quarterly Report
Open in viewerOpens in your device viewer
==> picture [192 x 354] intentionally omitted <==
華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd. （股票代號：2329）
Summary Part 1 Company Profile Part 2 Manufacture Service & Product Part 3 2024 Q3 Financial Performance Part 4 Competitive Advantage Part 5 Q&A
2/23
==> picture [169 x 91] intentionally omitted <==
Company Profile
==> picture [720 x 158] intentionally omitted <==
3/23
==> picture [52 x 95] intentionally omitted <==
Company History
==> picture [325 x 339] intentionally omitted <==
資本額 Capital : US$ 216M(NTD6.59B) Common Stock : US$ 184M Preferred C Stock : US$ 32M
2025
54th Anniversary Celebration
2015 & 2020
Strategic Partnership Announcement
2014
1st 16D microSD in the world
2005
Biz Transformation into Memory Market
Apr, 1994 IPO in Taiwan Stock Exchange (TSE: 2329)
1971 Established Founder : Dr. Eugene C. Y. Duh Headquarters : Kaohsiung, Taiwan
4/23
==> picture [52 x 95] intentionally omitted <==
==> picture [185 x 117] intentionally omitted <==
Headquarters (Flash Memory) (750,000 sq. ft.)
Factory
6 Production buildings in NTIP Headcount : around 5,800
==> picture [185 x 117] intentionally omitted <==
Facility 2 (59,223 sq. ft.)
LIC (256,200 sq. ft.)
==> picture [185 x 117] intentionally omitted <==
==> picture [185 x 117] intentionally omitted <==
Facility 3 (158,638 sq. ft.)
Facility 1 (146,475 sq ft.)
==> picture [186 x 117] intentionally omitted <==
==> picture [185 x 117] intentionally omitted <==
Facility 5 (190,000 sq. ft.)
5/23
==> picture [52 x 95] intentionally omitted <==
Organization
==> picture [702 x 366] intentionally omitted <==
----- Start of picture text -----
Chairman
Tony Tung
President
C. J. Tu
Testing Group Semiconductor Group EMS Group
• Memory IC Testing Service • Memory IC Packaging Service
• EMS Service
• Logic IC Testing Service • Logic IC Packaging Service
----- End of picture text -----
6/23
==> picture [169 x 91] intentionally omitted <==
Manufacture Service & Product
7/23
==> picture [52 x 95] intentionally omitted <==
Total Solution
IC Packaging & Testing Service
Drop Shipment Dry Pack Tape & Reel
==> picture [125 x 72] intentionally omitted <==
==> picture [151 x 78] intentionally omitted <==
Final Test
==> picture [112 x 141] intentionally omitted <==
Assembly
Wafer Grinding
Wafer Probing
8/23
==> picture [52 x 95] intentionally omitted <==
==> picture [80 x 38] intentionally omitted <==
Total Solution
Electronics Manufacturing Service
==> picture [140 x 146] intentionally omitted <==
==> picture [140 x 128] intentionally omitted <==
==> picture [140 x 128] intentionally omitted <==
==> picture [140 x 140] intentionally omitted <==
JDM, DFM, DFT NPI & Quick Turn Material Prototyping Procurement
Product Design from Customer
PCB Assembly
==> picture [140 x 122] intentionally omitted <==
==> picture [140 x 134] intentionally omitted <==
==> picture [124 x 122] intentionally omitted <==
==> picture [140 x 134] intentionally omitted <==
==> picture [140 x 122] intentionally omitted <==
Functionality & Reliability Testing
Repair and Distribution System Box Build Upgrade Support Integration
9/239
OSE CONFIDENTIAL
==> picture [52 x 95] intentionally omitted <==
Product Application
==> picture [716 x 326] intentionally omitted <==
10/23
==> picture [169 x 91] intentionally omitted <==
2025 Q3
Financial Performance
11/23
==> picture [52 x 95] intentionally omitted <==
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (QoQ)
| (Thousands of NTD) Net revenue Gross profit Operating income Income before tax Income tax(expense) gains Non controlling interests Net Income Basic EPS (in NTD) EBITDA |
Q3/2025 % 5,187,966 100.00% 846,337 16.31% 472,954 9.12% 538,656 10.38% (106,634) (2.06%) - - 432,022 8.33% 0.6 - 806,640 15.55% |
Q2/2024 % 5,263,888 100.00% 787,827 14.97% 419,883 7.98% 409,022 7.77% (21,829) (0.41%) - - 387,193 7.36% 0.54 - 669,705 12.72% |
Variance |
|---|---|---|---|
| (1.44%) 7.43% 12.64% 31.68% 388.50% - 11.58% - 20.45% |
12/23
==> picture [52 x 95] intentionally omitted <==
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (YoY)
| (Thousands of NTD) Net revenue Gross profit Operating income (loss) Income (loss) before tax Income tax (expense) gains Non controlling interests Net Income Basic EPS (in NTD) EBITDA |
Q3/2025 % 5,187,966 100.00% 846,337 16.31% 472,954 9.12% 538,656 10.38% (106,634) (2.06%) - - 432,022 8.33% 0.6 - 806,640 15.55% |
Q3/2024 % 3,914,051 100.00% 500,548 12.79% 186,906 4.78% 219,730 5.61% (42,439) (1.08%) - - 177,291 4.53% 0.25 - 449,209 11.48% |
Variance |
|---|---|---|---|
| 32.55% 69.08% 153.04% 145.14% 151.26% - 143.68% 140.00% 79.57% |
13/23
==> picture [52 x 95] intentionally omitted <==
Key Items & Index of Balance Sheet
| (Thousands of NTD) Cash and cash equivalents Financial assets measured at amortized cost Financial assets-Noncurrent & Investments-equity method Property, plant, and equipment Total assets Short-term loans & Short-term notes payable Long-Term Liabilities-Current Portion Long-term loans Total liabilities Total stockholders’ equity Quarterly EBITDA Index Debt ratio Accounts receivable turnover days(Q3) Inventory turnover days(Q3) |
Q3/2025 2,598,355 - 1,882,938 7,477,877 20,139,624 - 487,885 1,054,882 8,480,018 11,659,606 806,640 42.11% 90 Days 40 Days |
Q2/2025 3,437,751 - 1,441,800 6,982,388 20,317,276 - 465,872 897,925 9,163,846 11,153,430 669,705 45.10% 78 Days 37 Days |
Variance |
|---|---|---|---|
| (24.42%) - 30.60% 7.10% (0.87%) - 4.73% 17.48% (7.46%) 4.54% 20.45% |
14/23
==> picture [52 x 95] intentionally omitted <==
Key Items & Index of Balance Sheet
| (Thousands of NTD) Cash and cash equivalents Financial assets measured at amortized cost Financial assets-Noncurrent & Investments-equity method Property, plant, and equipment Total assets Short-term loans & Short-term notes payable Long-Term Liabilities-Current Portion Long-term loans Total liabilities Total stockholders’ equity Quarterly EBITDA Index Debt ratio Accounts receivable turnover days(Q1~Q3) Inventory turnover days(Q1~Q3) |
Q3/2025 2,598,355 - 1,882,938 7,477,877 20,139,624 - 487,885 1,054,882 8,480,018 11,659,606 - 806,640 42.11% 88 Days 39 Days |
Q3/2024 4,392,800 - 1,799,522 6,129,265 19,231,283 - 325,248 984,067 7,889,705 11,341,578 - 449,209 41.03% 95 Days 45 Days |
Variance |
|---|---|---|---|
| (40.85%) - 4.64% 22.00% 4.72% - 50.00% 7.20% 7.48% 2.80% - 79.57% |
15/23
==> picture [52 x 95] intentionally omitted <==
IC Packaging and Testing Services
(Thousands of NTD)
==> picture [682 x 307] intentionally omitted <==
----- Start of picture text -----
3,500,000 100%
3,117,660 3,207,475
3,020,022 90%
3,000,000
80%
2,588,094
2,500,000 2,332,625 70%
2,113,934 2,091,219
66% 60%
2,000,000 1,833,565 62%
62%
57% 57% 50%
1,500,000 52% 51%
47% 40%
30%
1,000,000
20%
500,000
10%
- 0%
Q4/2023 Q1/2024 Q2/2024 Q3/2024 Q4/2024 Q1/2025 Q2/2025 Q3/2025
營業收入淨額 佔全公司營收比重
----- End of picture text -----
16/23
==> picture [52 x 95] intentionally omitted <==
Electronics Manufacturing Services
(Thousands of NTD)
| - 500,000 1,000,000 1,500,000 2,000,000 2,500,000 |
1,618,622 1,587,935 1,946,426 2,080,486 2,035,786 1,744,851 2,243,866 1,980,491 34% 38% 48% 53% 49% 43% 43% 38% 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% Q4/2023 Q1/2024 Q2/2024 Q3/2024 Q4/2024 Q1/2025 營業收入淨額 佔全公司營收比重 |
|---|---|
17/23
==> picture [52 x 95] intentionally omitted <==
Semiconductor Group -Percentage of revenue by product application
==> picture [585 x 340] intentionally omitted <==
----- Start of picture text -----
100%
7% 9% 9% 9% 8% 7% 8% 9%
14% 13% 11%
15% 18% 18% 13%
80% 21%
60%
40% 79% 80% 81% 78%
76% 73% 74%
70%
20%
0%
Q4/2023 Q1/2024 Q2/2024 Q3/2024 Q4/2024 Q1/2025 Q2/2025 Q3/2025
記憶體相關產品 邏輯IC 測試
----- End of picture text -----
18/23
==> picture [52 x 95] intentionally omitted <==
2025 Q3 Operation Status Summary
-
Semiconductor BU
-
The memory industry has become a Seller’s market.
-
• Memory customers are actively stocking up, driving semiconductor revenue recovery and increasing its proportion of total company revenue.
-
• IC capacity utilization remains high.
-
EMS BU
-
Strong demand from AI server customers.
-
• Memory customers are actively stocking up; vertically integrated production of memory modules.
19/23
==> picture [169 x 91] intentionally omitted <==
Competitive Advantage
20/23
==> picture [292 x 503] intentionally omitted <==
==> picture [54 x 56] intentionally omitted <==
==> picture [51 x 51] intentionally omitted <==
==> picture [51 x 50] intentionally omitted <==
- Focus on Memory Market for 20 years.
- Efficient Manufacture Platform for Memory.
- Advanced Process Capability
-
25um wafer thickness
-
16 Layers Die Stacking for microSD/BGA/SD
-
1[ST] 1TB microSD announced to market
- Highly Systematized Production Environment
-
MES Automation System
-
One-Stop Service - High Degree of Flexibility on capacity allocation
21/23
==> picture [169 x 91] intentionally omitted <==
Q&A
22/23
==> picture [169 x 91] intentionally omitted <==
Disclaimer
The presentation and the relevant information mentioned in this material have been compiled from both internal and external resources. These forward looking statements involve known and unknown risks, uncertainties and other factors, including price variation, competition, global economy, exchange rate movement and market demand, which may cause actual results to differ materially from those implied by such forward-looking statements. The forward looking statements expressed in this material reflect the Company’s current view about the future as of today. The Company is not responsible for any updates if there are any changes in the future.
23/23