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2024 FIC Global Inc. KGI Earnings Call

2024/12/11 Copyright © Reserved By FIC Global Inc.

FIC Current Status

3CEMS Current Status Ubiqconn Current Status Group Business Motivation

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Balance Sheet Highlights

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Statements of Comprehensive Income

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AI PC Malaysia OPTICAL

CPO BARE DIE Techology

Brand+Satcom Sales Motivation SATCOM

HIGH PROFIT NEW PRODUCT

Smart Product Various Application SMART VERTICAL BD SHIPMENT

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3CEMS OPTICAL MODULES

MARKET STRENGTH

COMPLETE PRODUCT LINE

10G~800G Optical Modules MP, development of 1.6T, including others like CFP, SFP+QSFP28, OSFP, TXFP, QSFPDD.

SUPREME TECHOLOGY

， Support 008004 (0.25*0.125mm)SMT Bare die COB, Die/Wire Bonding.

PROFOUND EXPERIENCE

Over 15 years of optical modules design manufacturing & SMT team.

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To 10 Datacom Com anies
p p
Rankin Com anies
g p
1 Innoli ht
g
2 Coherent
3 Huawei
4 Cisco (Acacia)
5 Accelink
6 Hisense
7 Eo tolink
p
8 HG Genuine
9 Source Photonics
10 Marvell
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3CEMS OPTICAL MODULES MARKET FUTURE STATUS

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Unit: K

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4,000
3,000
2,000
1,000
0
2022 2023 2024 2025 2026 2027 2028
100G 200G 400G 800G
Source: Omdia
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3CEMS SEMICON SMT TECHNOLOGY

Semicon (COB)

SMT

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IC/BGA ACTIVE:
Wire-Bond
40G 100G 200/400G 400G 800G 1.6T
•
QSFP+ QSFP28 QSFP QSFP-DD QSFP SMT MP Smallest
QSFP-DD NPI Develop
MP 3.2T 0.27mm pitch
4x10G 4x25G 4x50G 4x100G 8x100G OSFP-XD
8x50G •
SMT+COB for
800G/1.6T smallest
2010 2014 2019 2021 2023 2024 2025
0.125mm pitch
Flip-chip pitch(mm):
IC/BGA 主動件 : Fine-pitch(mm) 0.5mm  0.4mm  0.35mm  0.27mm 0.15~0.125 /Φ65~70µm Cap
Chip 被動件 : 0201  01005 / 矽電容  008004 (T/R PASS) -bond
(Bare die ) CHIP PASSIVE:
COMMON SMD
BGA BGA(DSP) BGA(MCU) BCM87803A0-DIE1849 球
0.60.3 •
Smallest
008004(0201M)
0.40.2
2017 MP capability
LGA WLCSP QFP
0.07mm 0.250.125
• 01005 Yield Rate
Ceramic 99.996%
Silicon -bond
QFN SIP capacitor (40dppm) /2022
1.00.5
•
0201 Yield Rate
99.999%
(10dppm) /2022
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UBIQCONN FUTURE PLAN SATCOM & BRAND

• SATCOM

• CREATE ECO-SYSTEM, COMPLELTE SYSTEM INTEGRATION CAPABILITY

• ，

• EXPAND MARKET ： GEO  MEO  LEO BECOME THE LEADER OF SATCOM BUSINESS IN TAIWAN.

• BRAND

• EXPAND SALES CHANNLES

• SW/HW INTEGRATION AND TOTAL SOLUTION

• KEEP INVESTING R&D

• • KEEP INVESTING SMART MANUFACTURING

• 2023 2024 2025 2026 2027 2028

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BUSINESS GOAL

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LAUCH VEHICLE

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Phase 3 2023
LEO IoT
Phase 1 2011
GNSS
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UBIQCONN SATCOM APPLICATION BLUEPRINET

Phase 4 2024 LEO Land & Maritime Phase 2 2022 GEO / MEO Land & Maritime

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2025 Q2 2025 Q3 BRIDGE BUS ARHUD ARHUD ON SHIP ON CAR

2025 Q1 2025 Q1 DISPLAY AI PC SMART SMART INTERACTION Vertical MKT

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CORE COMPETIENCE

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O1/
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LBS PGU Technology, ARHUD MP Ready

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O2/
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LEO Receiver Antenna Technology and Box-Build Capability

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INNOVATION CAPABILITY
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O1/
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Optical Module Manufacturing with High Profits

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O2/
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IPC & Self-Brand for Military & Special Units

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O3/
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High-Precision Electronic DMS/EMS

ACHIEVING SUSTAINABLE OPERATIONS CAPABILITY: Join Design with Customer, LV/HM, Box-Build, and Turnkey Solution INNOVATION : AR HUD, AI Server, SATCOM Receiver Products

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STRATEGY

(BCG Growth/Share Matrix)

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AR HUD
AI OPTICAL MODULE
SATCOM
AI PC
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Thank You!

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